SOM-iMX8MP-SMARC

NXP i.MX8MP SMARC SoM

SoM-MX8MP-SMARC is a compact, high-performance module powered by the NXP i.MX8M Plus. It features a Quad ARM Cortex-A53, Cortex-M7, and a 2.3 TOPS NPU for advanced processing. With dual-band WiFi, BT5.0, and rich I/O options, it’s ideal for AI, multimedia, and industrial applications. Designed to SMARC 2.1 specifications, it ensures compatibility with various development boards.

  • Compliant with SMARC 2.1 standards, customizable carrier board
  • Quad-core Cortex-A53@1.8GHz & Cortex-M7@800MHz
  • 2.3 TOPS NPU, scalable up to 40 TOPS AI computing power
  • Up to 4GB RAM and 128GB eMMC
  • HDMI®, LVDS, MIPI-DSI, MIPI-CSI, USB, PCIe, GPIO, UART, I2C, SPI, CAN, I2S, SDIO
  • 2x GbE, Wi-Fi / Bluetooth optional
  • -40 to +85℃ industrial temperature range
CHIPSET NXP i.MX8M Plus
MARKET AREA Global
OSD LANGUAGE English/Chinese (multi language OSD)
Processor OS Android 10.0 and Linux(Yocto)
CPU Quad ARM Cortex-A53 up to 1.8GHz& Cortex M7 up to 800MHz
GPU GC7000UL with OpenCL and Vulkan support
NPU 2.3 TOP/s Neural Network performance
LPDDR4 4GB(1-4G Optional)
EMMC FLASH 16GB(16-128G Optional)
Wireless Network WiFi 2.4G/5G IEEE802.11 a/b/g/n/ac/ax
Bluetooth BT5.0
SMARC 2.1 Ethernet 2 x RGMII
PCIe 1 x PCIe Gen3(single lane)
USB2.0 *4
USB 3.0 *2
MIPI CSI *2(1*4 lane and 1*2 lane)
HDMI® *1(HDMI® 2.0)
LVDS *2(LVDS0 multiplex with MIPI DSI)
LVDS Backlight *1
I2S *2
MIPI DSI *1(multiplex with LVDS0)
GPIO *12
SDIO *1
UART *4
SPI *2
I2C *4
CAN *2
Vin 5V/3A
Dimensions 82 x 50 mm

APC880 Specification
DB820P Specification
SoM-iMX8MP-SMARC Specification
SOM-iMX8MP-SMARC CarrierBoard Specification

DB820P SMARC Carrier Board

This carrier board unlocks the full potential of the i.MX 8M Plus SMARC module, offering comprehensive industrial I/O and expansion options to rapidly build sophisticated vision AI and automation solutions.

  • High-speed interfaces: Dual GbE, USB 3.0, M.2 PCIe
  • Multiple display/camera: HDMI 2.0, LVDS, MIPI-CSI/DSI
  • Industrial connectivity: CAN bus, RS232/485, GPIO
  • Expandable AI acceleration via M.2 Key & Board-to-Board
  • Robust storage options with M.2 NVMe support
  • Scalable cellular with 4G/5G module support
  • Compact SMARC 2.1 form factor design
  • Wide-range power supply for industrial use

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